Õppeaine katab põhilisi nanoelektroonika kiipide töökindluse teemasid transistoridest süsteemide tasemini. See on mõeldud tuleviku arvutisüsteemide inseneridele ja teadlastele, kes spetsialiseeruvad riistvara, tarkvara, tehisintellekti (AI), asjade interneti (IoT), robootika ja küberturbe teadusharudele. Eesmärk on seletada kvaliteedi, töökindluse ning tootmise aspektide kasvavat tähtsust nanoelektroonika kiipide tehnoloogiates. Nanoelektroonika ajajärgul on riistvara tõrgete mehhanismide selgeks saamine elulise tähtsusega lõppsüsteemi usaldusväärsuse tagamiseks terveks süsteemi elueaks.

The course covers essential topics of reliability in nanoelectronic chips from transistors to systems. It is designed for future computing systems engineers and researchers specializing in a wide range of hardware, software, AI, IoT, robotics and cyber-security. The aim is to explain the growing importance of quality, reliability and manufacturing aspects in nanoelectronic chips technology. In the nanoelectronics era, the details of the hardware failure mechanisms are vital to master dependability of the target system through its entire lifespan.

Kursuse läbinud üliõpilane:
- teeb vahet nanoelektroonika kvaliteedi põhilistel probleemidel, k.a disainivead ja tootmisdefektid ning valib lähenemisi nende modelleerimiseks, testimiseks ja diagnoosiks;
- eristab nanoelektroonika töökindluse põhilisi probleeme, k.a peamisi tõrgete mehhanisme nanoelektroonika süsteemi elueas, lähenemisi nende modelleerimiseks, mõõtmiseks ja leevendamiseks;
- kombineerib riistvara kvaliteedi ja töökindluse mõju hinna-energia-kiiruse seosele ning usaldusväärsusele lõppsüsteemi tasemel.

Having completed the course a student:
- differentiates the essentials of quality in nanoelectronics, design and manufacturing defects, selects approaches for their modelling, testing and diagnosis;
- distinguishes the essentials of reliability in nanoelectronics, the main failure mechanisms during the nanoelectronic system's lifespan, approaches for their modelling, assessment and mitigation;
- combines the impact and tradeoffs of reliability and quality in system's hardware on the overall cost-energy-performance efficiency and dependability of the target system.

Õppeaine fookuses on:
- viimased arengud ja väljakutsed kiipide tootmisetehnoloogiates;
- tootmisparameetrite muutlikkusega seotud probleemid;
- tootmisdefektide modelleerimine, testimine ja diagnostika;
- nanoelektroonika vananemise fenomeni modelleerimine, analüüs ja leevendamine (Negative/Positive Bias Temperature Instability, Hot Carrier Injection, Time-Dependent Dielectric Breakdown, Electromigration, jne.);
- radiatsiooni põhjustatud vead (soft errors), nende efektid (single/multiple event upsets, transients, jne.) ning seotud kaitsmise ja maskeerimise tehnikad;
- tehisintellekti riistvaraliste kiirendite töökindlus ja serva-AI
- tööstuslikud standardid riistvara töökindluse tagamiseks;
- tärkavate tehnoloogiate töökindlus.

Praktikumi osaks on katsed kvaliteedi ja töökindluse probleemide simuleerimiseks raalprojekteerimistarkvara abil. Õppeaine osaks on interaktiivne seminar, mis on mõeldud töökindlusega seotud teemade arutamiseks väikestes rühmades.

The course focuses on:
- The latest advances and challenges in chips manufacturing technology
- Issues related to manufacturing-induced process variations
- Manufacturing defects modelling, test and diagnostics
- Nanoelectronics ageing, its modelling, assessment and mitigation (Negative/Positive Bias Temperature Instability, Hot Carrier Injection, Time-Dependent Dielectric Breakdown, Electromigration, etc.)
- Radiation-induced soft errors, their effects (single/multiple event upsets, transients, etc.) and dedicated hardening and masking techniques.
- AI hardware accelerators reliability. Edge AI.
- Industrial standards for robustness and low-level mechanisms for fault tolerance
- Reliability and test for emerging technologies

In the practical part of the course, the students will have hands-on experience with EDA (Electronic Design Automation) tools to simulate state-of-the-art reliability and quality issues in nanoelectronic systems (e.g. a processor chip design). An interactive seminar will facilitate team-work for small-group discussion topics assignments (e.g. one related failure mechanism).

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- R. Baumann, K. Kruckmeyer, Radiation Handbook for Electronics, Texas Instruments, 2020
- Neuberger, Gustavo, W., G., Reis, R., Protecting Chips Against Hold Time Violations Due to Variability, Springer 2014. Chapter 2
- Souvik M. Fundamentals of Bias Temperature Instability in MOS Transistors, Springer India 2016. Chapter 7: Reaction-Diffusion Model
- Space product assurance. Techniques for radiation effects mitigation in ASICs and FPGAs handbook. ECSS Secretariat. ESA-ESTEC. 2016
- Nicolaidis, M. Soft Errors in Modern Electronic Systems, 2011 Springer Chapter 2

Maksim Jenihhin, kaasprofessor tenuuris (IA - arvutisüsteemide instituut)